MC33907LAE

Manufacturer: NXP Semiconductors

Product Category: Telecommunication Circuits

Description:

Product Technical Specifications

Source Content uid:

MC33907LAER2

Manufacturer Part Number:

MC33907LAER2

Rohs Code:

Yes

Part Life Cycle Code:

Active

Package Description:

HLFQFP,

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.39.00.01

Manufacturer:

NXP Semiconductors

Risk Rank:

7.58

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level:

3

Number of Functions:

1

Number of Terminals:

48

Operating Temperature-Max:

125 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

HLFQFP

Package Shape:

SQUARE

Package Style:

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel):

260

Seated Height-Max:

1.6 mm

Surface Mount:

YES

Telecom IC Type:

INTERFACE CIRCUIT

Temperature Grade:

AUTOMOTIVE

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

0.5 mm

Terminal Position:

QUAD

Time@Peak Reflow Temperature-Max (s):

40

Width:

7 mm

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