MC68HC705B16MFU

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Product Technical Specifications

Part Life Cycle Code

Transferred

Part Package Code

QFP

Package Description

QFP, QFP64,.66SQ,32

Pin Count

64

Reach Compliance Code

unknown

HTS Code

8542.31.00.01

Has ADC

YES

Additional Feature

OPERATES AT 3.3V MINIMUM SUPPLY @ 1MHZ

Address Bus Width

Bit Size

8

CPU Family

6805

Clock Frequency-Max

4.2 MHz

DAC Channels

YES

DMA Channels

NO

External Data Bus Width

JESD-30 Code

S-PQFP-G64

JESD-609 Code

e0

Length

14 mm

Number of I/O Lines

32

Number of Terminals

64

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

QFP

Package Equivalence Code

QFP64,.66SQ,32

Package Shape

SQUARE

Package Style

FLATPACK

Qualification Status

Not Qualified

RAM (bytes)

352

ROM (words)

15168

ROM Programmability

OTPROM

Seated Height-Max

2.457 mm

Speed

2.1 MHz

Supply Current-Max

6 mA

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

Surface Mount

YES

Technology

HCMOS

Temperature Grade

AUTOMOTIVE

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Form

GULL WING

Terminal Pitch

0.8 mm

Terminal Position

QUAD

Width

14 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER

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