MCIMX6D5EYM10AD

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Product Technical Specifications

Source Content uid

MCIMX6D5EYM10AD

Rohs Code

Yes

Part Life Cycle Code

Active

Package Description

LFBGA,

Reach Compliance Code

compliant

ECCN Code

5A992.C

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Additional Feature

24MHZ NOMINAL FREQ AVAILABLE

Address Bus Width

16

Bit Size

64

Boundary Scan

YES

Clock Frequency-Max

24 MHz

External Data Bus Width

64

Format

FIXED POINT

Integrated Cache

YES

JESD-30 Code

S-PBGA-B624

JESD-609 Code

e1

Length

21 mm

Low Power Mode

YES

Moisture Sensitivity Level

3

Number of Terminals

624

Operating Temperature-Max

105 °C

Operating Temperature-Min

-20 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Seated Height-Max

1.6 mm

Speed

1000 MHz

Supply Voltage-Max

1.5 V

Supply Voltage-Min

1.35 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

40

Width

21 mm

uPs/uCs/Peripheral ICs Type

MULTIFUNCTION PERIPHERAL

Alternate Parts

MCIMX6D5EYM10AE

MCIMX6D5EYM10AE