MCIMX6Q7CVT08AD

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Product Technical Specifications

Source Content uid

MCIMX6Q7CVT08AD

Rohs Code

Yes

Part Life Cycle Code

Not Recommended

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

FBGA, BGA624,25X25,32

Reach Compliance Code

compliant

ECCN Code

5A992.C

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Additional Feature

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

JESD-30 Code

S-PBGA-B624

JESD-609 Code

e1

Length

21 mm

Moisture Sensitivity Level

3

Number of Terminals

624

Operating Temperature-Max

105 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA624,25X25,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (Cel)

260

Seated Height-Max

2.16 mm

Supply Voltage-Max

1.5 V

Supply Voltage-Min

1.275 V

Supply Voltage-Nom

1.4 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

40

Width

21 mm

uPs/uCs/Peripheral ICs Type

SoC

Alternate Parts

MCIMX6Q7CVT08AE

TPS79801QDGNRQ1