MCIMX6Z0DVM09AB

Manufacturer: NXP Semiconductors

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Source Content uid:

MCIMX6Z0DVM09AB

Manufacturer Part Number:

MCIMX6Z0DVM09AB

Rohs Code:

Yes

Part Life Cycle Code:

Active

Package Description:

,

Reach Compliance Code:

unknown

ECCN Code:

5A992.C

HTS Code:

8542.31.00.01

Date Of Intro:

2018-11-02

Manufacturer:

NXP Semiconductors

Risk Rank:

2.35

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level:

3

Number of Terminals:

289

Operating Temperature-Max:

95 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

LFBGA

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

SQUARE

Package Style:

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel):

260

Seated Height-Max:

1.32 mm

Supply Voltage-Max:

1.5 V

Supply Voltage-Min:

1.375 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

0.8 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

40

Width:

14 mm

uPs/uCs/Peripheral ICs Type:

SoC

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