MCIMX6Z0DVM09AB

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Product Technical Specifications

Source Content uid

MCIMX6Z0DVM09AB

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

,

Reach Compliance Code

unknown

ECCN Code

5A992.C

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Date Of Intro

2018-11-02

JESD-30 Code

S-PBGA-B289

JESD-609 Code

e1

Length

14 mm

Moisture Sensitivity Level

3

Number of Terminals

289

Operating Temperature-Max

95 °C

Operating Temperature-Min

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA289,17X17,32

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Seated Height-Max

1.32 mm

Supply Voltage-Max

1.5 V

Supply Voltage-Min

1.375 V

Surface Mount

YES

Technology

CMOS

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

40

Width

14 mm

uPs/uCs/Peripheral ICs Type

SoC