MK64FX512VDC12

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Product Technical Specifications

Source Content uid

MK64FX512VDC12

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

BGA,

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Has ADC

YES

Address Bus Width

Clock Frequency-Max

50 MHz

DAC Channels

YES

DMA Channels

YES

External Data Bus Width

JESD-30 Code

S-PBGA-B121

JESD-609 Code

e1

Moisture Sensitivity Level

3

Number of I/O Lines

86

Number of Terminals

121

Operating Temperature-Max

105 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

260

ROM Programmability

FLASH

Speed

120 MHz

Supply Voltage-Max

3.6 V

Supply Voltage-Min

1.71 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

40

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Alternate Parts

MK64FX1M0VDC12

MK64FN1M0VDC12