MK66FN2M0VLQ18

Manufacturer: NXP Semiconductors

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Source Content uid:

MK66FN2M0VLQ18

Manufacturer Part Number:

MK66FN2M0VLQ18

Rohs Code:

Yes

Part Life Cycle Code:

Active

Package Description:

FQFP, QFP144,.87SQ,20

Reach Compliance Code:

compliant

ECCN Code:

3A991.A.2

HTS Code:

8542.31.00.01

Manufacturer:

NXP Semiconductors

Risk Rank:

1.47

Has ADC:

YES

Bit Size:

CPU Family:

CORTEX-M4F

Clock Frequency-Max:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

Length:

20 mm

Moisture Sensitivity Level:

Number of I/O Lines:

100

Number of Terminals:

144

Operating Temperature-Max:

105 °C

Operating Temperature-Min:

-40 °C

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

FQFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

SQUARE

Package Style:

FLATPACK, FINE PITCH

Peak Reflow Temperature (Cel):

260

Power Supplies:

1.8/3.3 V

Qualification Status:

Not Qualified

RAM (bytes):

262144

ROM (words):

2097152

ROM Programmability:

FLASH

Speed:

180 MHz

Subcategory:

Microcontrollers

Supply Current-Max:

115.08 mA

Supply Voltage-Max:

3.6 V

Supply Voltage-Min:

1.71 V

Supply Voltage-Nom:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

0.5 mm

Terminal Position:

QUAD

Time@Peak Reflow Temperature-Max (s):

Width:

20 mm

uPs/uCs/Peripheral ICs Type:

MICROCONTROLLER, RISC

Cart

MK66FN2M0VLQ18

Product Technical Specifications

Source Content uid:

Manufacturer Part Number:

Rohs Code:

Part Life Cycle Code:

Package Description:

Reach Compliance Code:

ECCN Code:

HTS Code:

Manufacturer:

Risk Rank:

Has ADC:

Bit Size:

CPU Family:

Clock Frequency-Max:

DAC Channels:

DMA Channels:

JESD-30 Code:

JESD-609 Code:

Length:

Moisture Sensitivity Level:

Number of I/O Lines:

Number of Terminals:

Operating Temperature-Max:

Operating Temperature-Min:

PWM Channels:

Package Body Material:

Package Code:

Package Equivalence Code:

Package Shape:

Package Style:

Peak Reflow Temperature (Cel):

Power Supplies:

Qualification Status:

RAM (bytes):

ROM (words):

ROM Programmability:

Speed:

Subcategory:

Supply Current-Max:

Supply Voltage-Max:

Supply Voltage-Min:

Supply Voltage-Nom:

Surface Mount:

Technology:

Temperature Grade:

Terminal Finish:

Terminal Form:

Terminal Pitch:

Terminal Position:

Time@Peak Reflow Temperature-Max (s):

Width:

uPs/uCs/Peripheral ICs Type:

Alternate Parts

Datasheets

Datasheets Files List

Datasheets PDF View

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