MK66FX1M0VMD18

No Match Found

Product Technical Specifications

Source Content uid

MK66FX1M0VMD18

Rohs Code

Yes

Part Life Cycle Code

Active

Package Description

BGA, BGA144,12X12,40

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Has ADC

YES

Address Bus Width

Bit Size

32

CPU Family

CORTEX-M4F

Clock Frequency-Max

50 MHz

DAC Channels

YES

DMA Channels

YES

External Data Bus Width

JESD-30 Code

S-PBGA-B144

JESD-609 Code

e1

Length

13 mm

Moisture Sensitivity Level

3

Number of I/O Lines

100

Number of Terminals

144

Operating Temperature-Max

105 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA144,12X12,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

260

Power Supplies

1.8/3.3 V

Qualification Status

Not Qualified

RAM (bytes)

262144

ROM (words)

1310720

ROM Programmability

FLASH

Speed

180 MHz

Supply Current-Max

115.08 mA

Supply Voltage-Max

3.6 V

Supply Voltage-Min

1.71 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

40

Width

13 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Fast Shipping