MPC5554MVR132

No Match Found

Product Technical Specifications

Source Content uid

MPC5554MVR132

Rohs Code

Yes

Part Life Cycle Code

Not Recommended

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

HBGA, BGA416,26X26,40

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Has ADC

YES

Additional Feature

IT ALSO REQUIRES 3.3V SUPPLY

Address Bus Width

24

Bit Size

32

Clock Frequency-Max

20 MHz

DAC Channels

NO

DMA Channels

NO

External Data Bus Width

32

JESD-30 Code

S-PBGA-B416

JESD-609 Code

e1

Length

27 mm

Moisture Sensitivity Level

3

Number of I/O Lines

220

Number of Terminals

416

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

HBGA

Package Equivalence Code

BGA416,26X26,40

Package Shape

SQUARE

Package Style

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (Cel)

260

Power Supplies

1.5,3.3,5 V

Qualification Status

Not Qualified

RAM (bytes)

65536

ROM (words)

2097152

ROM Programmability

FLASH

Seated Height-Max

2.55 mm

Speed

132 MHz

Supply Current-Max

600 mA

Supply Voltage-Max

1.65 V

Supply Voltage-Min

1.35 V

Supply Voltage-Nom

1.5 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

AUTOMOTIVE

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

40

Width

27 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER

Fast Shipping

Alternate Parts

MPC5554AVR132

MPC554MZP132

SPC5554MZP132

SPC5554MVR132