MPC5566MZP144R

Manufacturer: NXP Semiconductors

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Source Content uid:

MPC5566MZP144R

Manufacturer Part Number:

MPC5566MZP144R

Rohs Code:

No

Part Life Cycle Code:

Active

Package Description:

27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416

Reach Compliance Code:

unknown

HTS Code:

8542.31.00.01

Manufacturer:

NXP Semiconductors

Risk Rank:

7.28

Has ADC:

YES

Additional Feature:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

Clock Frequency-Max:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e0

Length:

27 mm

Moisture Sensitivity Level:

3

Number of I/O Lines:

256

Number of Terminals:

416

Operating Temperature-Max:

125 °C

Operating Temperature-Min:

-40 °C

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

HBGA

Package Equivalence Code:

BGA416,26X26,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY, HEAT SINK/SLUG

Power Supplies:

1.5,3.3,5 V

Qualification Status:

Not Qualified

RAM (bytes):

131072

ROM (words):

3145728

ROM Programmability:

FLASH

Seated Height-Max:

2.55 mm

Speed:

144 MHz

Subcategory:

Microcontrollers

Supply Current-Max:

820 mA

Supply Voltage-Max:

1.65 V

Supply Voltage-Min:

1.35 V

Supply Voltage-Nom:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

AUTOMOTIVE

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

uPs/uCs/Peripheral ICs Type:

MICROCONTROLLER, RISC

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