MPC8270ZUUPEA

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Product Technical Specifications

Source Content uid

MPC8270ZUUPEA

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

LBGA, BGA480,29X29,50

Reach Compliance Code

not_compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Address Bus Width

32

Bit Size

32

Boundary Scan

YES

Clock Frequency-Max

100 MHz

External Data Bus Width

64

Format

FLOATING POINT

Integrated Cache

YES

JESD-30 Code

S-PBGA-B480

JESD-609 Code

e0

Length

37.5 mm

Low Power Mode

NO

Moisture Sensitivity Level

4

Number of Terminals

480

Operating Temperature-Max

70 °C

Operating Temperature-Min

Package Body Material

PLASTIC/EPOXY

Package Code

LBGA

Package Equivalence Code

BGA480,29X29,50

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (Cel)

260

Power Supplies

1.5,3.3 V

Qualification Status

Not Qualified

Seated Height-Max

1.65 mm

Speed

100 MHz

Supply Voltage-Max

1.6 V

Supply Voltage-Min

1.45 V

Supply Voltage-Nom

1.5 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

COMMERCIAL

Terminal Finish

TIN LEAD SILVER

Terminal Form

BALL

Terminal Pitch

1.27 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

40

Width

37.5 mm

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

Alternate Parts

KMPC8270CZUUPE