MSP430F2619TZQW Texas Instruments | Chip 1 Exchange

MSP430F2619TZQW

Manufacturer: Texas Instruments

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Source Content uid:

MSP430F2619TZQW

Manufacturer Part Number:

MSP430F2619TZQW

Brand Name:

Texas Instruments

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

TEXAS INSTRUMENTS INC

Part Package Code:

BGA

Package Description:

VFBGA, BGA113,12X12,20

Pin Count:

113

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.31.00.01

Factory Lead Time:

1 Week

Manufacturer:

Texas Instruments

Risk Rank:

5.8

Samacsys Description:

TEXAS INSTRUMENTS - MSP430F2619TZQW - MSP430 Microcontroller, MSP430 Family MSP430F2x Series Microcontrollers, MSP430, 16bit, 16 MHz

Samacsys Manufacturer:

Texas Instruments

Has ADC:

YES

Additional Feature:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Clock Frequency-Max:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level:

3

Number of DMA Channels:

3

Number of I/O Lines:

64

Number of Serial I/Os:

2

Number of Terminals:

113

Number of Timers:

10

On Chip Program ROM Width:

8

Operating Temperature-Max:

105 °C

Operating Temperature-Min:

-40 °C

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

VFBGA

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

SQUARE

Package Style:

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel):

260

Power Supplies:

2/3.3 V

Qualification Status:

Not Qualified

RAM (bytes):

4096

RAM (words):

4

ROM (words):

122880

ROM Programmability:

FLASH

Seated Height-Max:

1 mm

Speed:

16 MHz

Subcategory:

Microcontrollers

Supply Current-Max:

0.595 mA

Supply Voltage-Max:

3.6 V

Supply Voltage-Min:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

0.5 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

7 mm

uPs/uCs/Peripheral ICs Type:

MICROCONTROLLER, RISC

Fast Shipping