MT47H64M16NF25EM

No Match Found

Product Technical Specifications

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Active

Part Package Code

BGA

Package Description

TFBGA, BGA84,9X15,32

Pin Count

84

Reach Compliance Code

not_compliant

ECCN Code

EAR99

HTS Code

8542.32.00.32

Factory Lead Time

53 Weeks, 1 Day

Access Mode

MULTI BANK PAGE BURST

Access Time-Max

0.4 ns

Additional Feature

SELF REFRESH

Clock Frequency-Max (fCLK)

400 MHz

I/O Type

COMMON

Interleaved Burst Length

4,8

JESD-30 Code

R-PBGA-B84

JESD-609 Code

e1

Length

12.5 mm

Memory Density

1073741824 bit

Memory IC Type

DDR2 DRAM

Memory Width

16

Number of Functions

1

Number of Ports

1

Number of Terminals

84

Number of Words

67108864 words

Number of Words Code

64000000

Operating Mode

SYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

Organization

64MX16

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Equivalence Code

BGA84,9X15,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Power Supplies

1.8 V

Qualification Status

Not Qualified

Refresh Cycles

8192

Seated Height-Max

1.2 mm

Self Refresh

YES

Sequential Burst Length

4,8

Supply Voltage-Max (Vsup)

1.9 V

Supply Voltage-Min (Vsup)

1.7 V

Supply Voltage-Nom (Vsup)

1.8 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Width

8 mm