MT47H64M16NF25EITM

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Product Technical Specifications

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Active

Part Package Code

BGA

Package Description

TFBGA, BGA84,9X15,32

Pin Count

84

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.32.00.32

Access Mode

MULTI BANK PAGE BURST

Additional Feature

AUTO/SELF REFRESH

Clock Frequency-Max (fCLK)

400 MHz

I/O Type

COMMON

Interleaved Burst Length

4,8

JESD-30 Code

R-PBGA-B84

JESD-609 Code

e1

Length

12.5 mm

Memory Density

1073741824 bit

Memory IC Type

DDR2 DRAM

Memory Width

16

Number of Functions

1

Number of Ports

1

Number of Terminals

84

Number of Words

67108864 words

Number of Words Code

64000000

Operating Mode

SYNCHRONOUS

Operating Temperature-Max

95 °C

Operating Temperature-Min

-40 °C

Organization

64MX16

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Equivalence Code

BGA84,9X15,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Power Supplies

1.8 V

Qualification Status

Not Qualified

Refresh Cycles

8192

Screening Level

AEC-Q100

Seated Height-Max

1.2 mm

Self Refresh

YES

Sequential Burst Length

4,8

Standby Current-Max

0.01 A

Supply Current-Max

0.26 mA

Supply Voltage-Max (Vsup)

1.9 V

Supply Voltage-Min (Vsup)

1.7 V

Supply Voltage-Nom (Vsup)

1.8 V

Surface Mount

YES

Technology

CMOS

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Width

8 mm

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