MT8870DE Zarlink Semiconductor Inc | Chip 1 Exchange

MT8870DE

Manufacturer: Zarlink Semiconductor Inc

Product Category: Telecommunication Circuits

Description:

Product Technical Specifications

Manufacturer Part Number:

MT8870DE

Rohs Code:

No

Part Life Cycle Code:

Obsolete

Package Description:

PLASTIC, MS-001AC, DIP-18

Reach Compliance Code:

unknown

HTS Code:

8542.39.00.01

Manufacturer:

Zarlink Semiconductor Inc

Risk Rank:

8.02

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e0

Length:

22.86 mm

Number of Functions:

1

Number of Terminals:

18

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

RECTANGULAR

Package Style:

IN-LINE

Peak Reflow Temperature (Cel):

225

Power Supplies:

5 V

Qualification Status:

Not Qualified

Seated Height-Max:

5.33 mm

Subcategory:

Telecom Signaling Circuits

Supply Current-Max:

0.009 mA

Supply Voltage-Nom:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

DTMF SIGNALING CIRCUIT

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

30

Width:

7.62 mm

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