MTFC16GAKAENA4MITTR

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Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Package Description

TBGA,

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.32.00.51

JESD-30 Code

R-PBGA-B100

JESD-609 Code

e1

Length

18 mm

Memory Density

137438953472 bit

Memory IC Type

FLASH CARD

Memory Width

8

Moisture Sensitivity Level

3

Number of Functions

1

Number of Terminals

100

Number of Words

17179869184 words

Number of Words Code

16000000000

Operating Mode

SYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

16GX8

Package Body Material

PLASTIC/EPOXY

Package Code

TBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE

Parallel/Serial

PARALLEL

Peak Reflow Temperature (Cel)

260

Programming Voltage

2.7 V

Seated Height-Max

1.2 mm

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

2.7 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Width

14 mm