NAND01GR3B2BZA6E

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Product Technical Specifications

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Part Package Code

BGA

Package Description

TFBGA, BGA63,10X12,32

Pin Count

63

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.32.00.51

Access Time-Max

30 ns

Command User Interface

YES

Data Polling

NO

JESD-30 Code

R-PBGA-B63

JESD-609 Code

e1

Length

12 mm

Memory Density

1073741824 bit

Memory IC Type

FLASH

Memory Width

8

Number of Functions

1

Number of Sectors/Size

1K

Number of Terminals

63

Number of Words

134217728 words

Number of Words Code

128000000

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

128MX8

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Equivalence Code

BGA63,10X12,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Page Size

2K words

Parallel/Serial

PARALLEL

Power Supplies

1.8 V

Programming Voltage

1.8 V

Qualification Status

Not Qualified

Ready/Busy

YES

Seated Height-Max

1.05 mm

Sector Size

128K

Standby Current-Max

0.00005 A

Supply Current-Max

0.015 mA

Supply Voltage-Max (Vsup)

1.95 V

Supply Voltage-Min (Vsup)

1.7 V

Supply Voltage-Nom (Vsup)

1.8 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Toggle Bit

NO

Type

SLC NAND TYPE

Width

9.5 mm

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