NAND02GR3B2DZA6F

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Product Technical Specifications

Source Content uid

NAND02GR3B2DZA6F

Rohs Code

Yes

Part Life Cycle Code

Transferred

Package Description

FBGA, BGA63,10X12,32

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.51

Access Time-Max

20 ns

Command User Interface

YES

Data Polling

NO

JESD-30 Code

R-PBGA-B63

Memory Density

2147483648 bit

Memory IC Type

FLASH

Memory Width

8

Number of Sectors/Size

2K

Number of Terminals

63

Number of Words

268435456 words

Number of Words Code

256000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

256MX8

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA63,10X12,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Page Size

2K words

Parallel/Serial

PARALLEL

Power Supplies

1.8 V

Qualification Status

Not Qualified

Ready/Busy

YES

Sector Size

128K

Standby Current-Max

0.00005 A

Supply Current-Max

0.02 mA

Supply Voltage-Nom (Vsup)

1.8 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Toggle Bit

NO