NAND02GW3B2CN6

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Product Technical Specifications

Part Life Cycle Code

Obsolete

Part Package Code

TSOP

Package Description

TSSOP,

Pin Count

48

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.51

JESD-30 Code

R-PDSO-G48

Length

18.4 mm

Memory Density

2147483648 bit

Memory IC Type

FLASH

Memory Width

8

Number of Functions

1

Number of Terminals

48

Number of Words

268435456 words

Number of Words Code

256000000

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

256MX8

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel/Serial

PARALLEL

Programming Voltage

3 V

Seated Height-Max

1.2 mm

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

2.7 V

Supply Voltage-Nom (Vsup)

3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

DUAL

Width

12 mm