NAND512W3A2SZA6E

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Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Package Description

VFBGA-63

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.32.00.51

Access Time-Max

35 ns

Command User Interface

YES

Data Polling

NO

JESD-30 Code

R-PBGA-B63

JESD-609 Code

e2

Length

11 mm

Memory Density

536870912 bit

Memory IC Type

FLASH

Memory Width

8

Number of Functions

1

Number of Sectors/Size

4K

Number of Terminals

63

Number of Words

67108864 words

Number of Words Code

64000000

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

64MX8

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Equivalence Code

BGA63,10X12,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Page Size

512 words

Parallel/Serial

PARALLEL

Peak Reflow Temperature (Cel)

260

Power Supplies

3/3.3 V

Programming Voltage

3 V

Qualification Status

Not Qualified

Ready/Busy

YES

Seated Height-Max

1.05 mm

Sector Size

16K

Standby Current-Max

0.00005 A

Supply Current-Max

0.02 mA

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

2.7 V

Supply Voltage-Nom (Vsup)

3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Toggle Bit

NO

Type

SLC NAND TYPE

Width

9 mm

Alternate Parts

NAND512W3A2DZA6E

NAND512W3A2SZAXE