NT2H1311F0DTL

Manufacturer: NXP Semiconductors

Product Category: Telecommunication Circuits

Description:

Product Technical Specifications

Source Content uid:

NT2H1311F0DTL

Manufacturer Part Number:

NT2H1311F0DTL

Part Life Cycle Code:

Active

Package Description:

2 X 1.50 MM, 0.50 MM, PLASTIC, SOT1312AB2, HXSON-4

Reach Compliance Code:

unknown

HTS Code:

8542.39.00.01

Manufacturer:

NXP Semiconductors

Risk Rank:

7.55

JESD-30 Code:

R-PDSO-N4

Length:

2 mm

Number of Functions:

1

Number of Terminals:

4

Operating Temperature-Max:

70 °C

Operating Temperature-Min:

-25 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

HVSON

Package Shape:

RECTANGULAR

Package Style:

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Seated Height-Max:

0.5 mm

Surface Mount:

YES

Telecom IC Type:

TELECOM CIRCUIT

Temperature Grade:

OTHER

Terminal Form:

NO LEAD

Terminal Pitch:

0.5 mm

Terminal Position:

DUAL

Width:

1.5 mm

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