PC28F128P33TF60

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Product Technical Specifications

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Package Description

BGA-64

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.51

Access Time-Max

60 ns

Boot Block

TOP

JESD-30 Code

R-PBGA-B64

Length

10 mm

Memory Density

134217728 bit

Memory IC Type

FLASH

Memory Width

16

Number of Functions

1

Number of Terminals

64

Number of Words

8388608 words

Number of Words Code

8000000

Operating Mode

SYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

8MX16

Package Body Material

PLASTIC/EPOXY

Package Code

TBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE

Parallel/Serial

PARALLEL

Programming Voltage

3 V

Seated Height-Max

1.2 mm

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

2.3 V

Supply Voltage-Nom (Vsup)

3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Type

NOR TYPE

Width

8 mm