PC28F256P30BFE Micron Technology Inc | Chip 1 Exchange

PC28F256P30BFE

Manufacturer: Micron Technology Inc

Product Category: Memory

Description:

Product Technical Specifications

Manufacturer Part Number:

PC28F256P30BFE

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Part Package Code:

BGA

Package Description:

TBGA, BGA64,8X8,40

Pin Count:

64

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.32.00.51

Manufacturer:

Micron Technology Inc

Risk Rank:

5.79

Access Time-Max:

100 ns

Additional Feature:

ASYNCHRONOUS READ MODE

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

268435456 bit

Memory IC Type:

FLASH

Memory Width:

16

Number of Functions:

1

Number of Sectors/Size:

4,255

Number of Terminals:

64

Number of Words:

16777216 words

Number of Words Code:

16000000

Operating Mode:

SYNCHRONOUS

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

TBGA

Package Equivalence Code:

BGA64,8X8,40

Package Shape:

RECTANGULAR

Package Style:

GRID ARRAY, THIN PROFILE

Parallel/Serial:

PARALLEL

Peak Reflow Temperature (Cel):

260

Power Supplies:

1.8,1.8/3.3 V

Programming Voltage:

1.8 V

Qualification Status:

Not Qualified

Seated Height-Max:

1.2 mm

Sector Size:

16K,64K

Standby Current-Max:

0.00021 A

Subcategory:

Flash Memories

Supply Current-Max:

0.031 mA

Supply Voltage-Max (Vsup):

2 V

Supply Voltage-Min (Vsup):

1.7 V

Supply Voltage-Nom (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

30

Toggle Bit:

NO

Type:

NOR TYPE

Width:

10 mm

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