PC28F256P33BFE

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Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Package Description

TBGA, BGA64,8X8,40

Reach Compliance Code

compliant

ECCN Code

EAR99

HTS Code

8542.32.00.51

Access Time-Max

95 ns

Additional Feature

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE

Boot Block

BOTTOM

Command User Interface

YES

Common Flash Interface

YES

Data Polling

JESD-30 Code

R-PBGA-B64

JESD-609 Code

Length

13 mm

Memory Density

268435456 bit

Memory IC Type

FLASH

Memory Width

Number of Functions

Number of Sectors/Size

4,255

Number of Terminals

Number of Words

16777216 words

Number of Words Code

16000000

Operating Mode

SYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

16MX16

Package Body Material

PLASTIC/EPOXY

Package Code

TBGA

Package Equivalence Code

BGA64,8X8,40

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE

Parallel/Serial

PARALLEL

Power Supplies

2.5/3.3 V

Programming Voltage

3 V

Qualification Status

Not Qualified

Seated Height-Max

1.2 mm

Sector Size

16K,64K

Standby Current-Max

0.00021 A

Supply Current-Max

0.031 mA

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

2.3 V

Supply Voltage-Nom (Vsup)

3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position