PCA85073ADPQ900Z

Manufacturer: NXP Semiconductors

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Manufacturer Part Number:

PCA85073ADP/Q900Z

Rohs Code:

Yes

Part Life Cycle Code:

Active

Package Description:

TSSOP, TSSOP8,.19

Reach Compliance Code:

unknown

ECCN Code:

EAR99

HTS Code:

8542.39.00.01

Date Of Intro:

2019-10-04

Manufacturer:

NXP Semiconductors

Risk Rank:

7.73

Clock Frequency-Max:

0.032768 MHz

Information Access Method:

I2C

Interrupt Capability:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

Length:

3 mm

Moisture Sensitivity Level:

Number of Terminals:

Number of Timers:

Operating Temperature-Max:

105 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

TSSOP

Package Equivalence Code:

TSSOP8,.19

Package Shape:

SQUARE

Package Style:

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (Cel):

260

Screening Level:

AEC-Q100

Seated Height-Max:

1.1 mm

Supply Current-Max:

50 mA

Supply Voltage-Max:

5.5 V

Supply Voltage-Min:

1.8 V

Supply Voltage-Nom:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

0.65 mm

Terminal Position:

DUAL

Time@Peak Reflow Temperature-Max (s):

Volatile:

Width: