PEF22827ELV1.1 Infineon Technologies AG | Chip 1 Exchange

PEF22827ELV1.1

Manufacturer: Infineon Technologies AG

Product Category: Telecommunication Circuits

Description:

Product Technical Specifications

Source Content uid:

PEF22827ELV1.1

Manufacturer Part Number:

PEF22827ELV1.1

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

INFINEON TECHNOLOGIES AG

Reach Compliance Code:

compliant

Manufacturer:

Infineon Technologies AG

Risk Rank:

5.84

JESD-30 Code:

S-PBGA-B225

Moisture Sensitivity Level:

3

Number of Terminals:

225

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

FBGA

Package Equivalence Code:

BGA225,15X15,32

Package Shape:

SQUARE

Package Style:

GRID ARRAY, FINE PITCH

Power Supplies:

1.8,3.3 V

Qualification Status:

Not Qualified

Subcategory:

Modems

Surface Mount:

YES

Telecom IC Type:

MODEM

Temperature Grade:

INDUSTRIAL

Terminal Form:

BALL

Terminal Pitch:

0.8 mm

Terminal Position:

BOTTOM

Fast Shipping