PIC18LF25K22IML

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Product Technical Specifications

Source Content uid

PIC18LF25K22-I/ML

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Active

Part Package Code

QFN

Package Description

6 X 6 MM, LEAD FREE, PLASTIC, QFN-28

Pin Count

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Has ADC

YES

Additional Feature

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 20 MHZ

Address Bus Width

Bit Size

Boundary Scan

CPU Family

PIC18

Clock Frequency-Max

64 MHz

DAC Channels

YES

DMA Channels

External Data Bus Width

Format

FIXED POINT

Integrated Cache

JESD-30 Code

S-PQCC-N28

JESD-609 Code

Length

6 mm

Low Power Mode

YES

Moisture Sensitivity Level

Number of DMA Channels

Number of I/O Lines

Number of Terminals

Number of Timers

On Chip Data RAM Width

On Chip Program ROM Width

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

HVQCCN

Package Equivalence Code

LCC28,.24SQ,25

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (Cel)

260

Power Supplies

2/3.3 V

Qualification Status

Not Qualified

RAM (bytes)

1536

RAM (words)

1536

ROM (words)

16384

ROM Programmability

FLASH

Seated Height-Max

1 mm

Speed

64 MHz

Supply Current-Max

12 mA

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2.7 V

Supply Voltage-Nom

3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Matte Tin (Sn)

Terminal Form

NO LEAD

Terminal Pitch

0.65 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

Width