PXA255A0E300 Intel Corporation | Chip 1 Exchange

PXA255A0E300

Manufacturer: Intel Corporation

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Manufacturer Part Number:

GDPXA255A0E300

Rohs Code:

No

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

INTEL CORP

Part Package Code:

BGA

Package Description:

BGA, BGA256,16X16,40

Pin Count:

256

Reach Compliance Code:

unknown

HTS Code:

8542.31.00.01

Manufacturer:

Intel Corporation

Risk Rank:

5.89

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Clock Frequency-Max:

3.6864 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level:

1

Number of Terminals:

256

Operating Temperature-Max:

100 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

225

Power Supplies:

1.1,2.5/3.3,3.3 V

Qualification Status:

Not Qualified

Seated Height-Max:

2 mm

Speed:

300 MHz

Subcategory:

Microprocessors

Supply Voltage-Max:

1.43 V

Supply Voltage-Min:

1.045 V

Supply Voltage-Nom:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Width:

17 mm

uPs/uCs/Peripheral ICs Type:

MICROPROCESSOR

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