R1LV0416CBG5SI

Manufacturer: Renesas Electronics Corporation

Product Category: Memory

Description:

Product Technical Specifications

Source Content uid:

R1LV0416CBG-5SI

Manufacturer Part Number:

R1LV0416CBG-5SI

Part Life Cycle Code:

Transferred

Ihs Manufacturer:

RENESAS ELECTRONICS CORP

Part Package Code:

BGA

Package Description:

TFBGA,

Pin Count:

Reach Compliance Code:

unknown

ECCN Code:

3A991.B.2.A

HTS Code:

8542.32.00.41

Manufacturer:

Renesas Electronics Corporation

Risk Rank:

7.98

Access Time-Max:

55 ns

Additional Feature:

IT CAN ALSO OPERATE AT 3V

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

Length:

8.5 mm

Memory Density:

4194304 bit

Memory IC Type:

STANDARD SRAM

Memory Width:

Number of Functions:

Number of Terminals:

Number of Words:

262144 words

Number of Words Code:

256000

Operating Mode:

ASYNCHRONOUS

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

TFBGA

Package Shape:

RECTANGULAR

Package Style:

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel/Serial:

PARALLEL

Qualification Status:

Not Qualified

Seated Height-Max:

1.2 mm

Supply Voltage-Max (Vsup):

3.6 V

Supply Voltage-Min (Vsup):

2.2 V

Supply Voltage-Nom (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

0.75 mm

Terminal Position:

BOTTOM

Width:

7.5 mm

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