S3C2410A20YO80

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Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

14 X 14 MM, ROHS COMPLIANT, BGA-272

Reach Compliance Code

compliant

HTS Code

8542.31.00.01

Address Bus Width

28

Bit Size

32

Boundary Scan

YES

Clock Frequency-Max

20 MHz

External Data Bus Width

32

Format

FIXED POINT

Integrated Cache

YES

JESD-30 Code

S-PBGA-B272

Length

14 mm

Low Power Mode

YES

Number of Terminals

272

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Seated Height-Max

1.26 mm

Speed

200 MHz

Supply Voltage-Max

1.95 V

Supply Voltage-Min

1.65 V

Supply Voltage-Nom

1.8 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Width

14 mm

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

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