S87C7512N24

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Product Technical Specifications

Rohs Code

No

Part Life Cycle Code

Transferred

Ihs Manufacturer

PHILIPS SEMICONDUCTORS

Package Description

DIP, DIP24,.3

Reach Compliance Code

unknown

HTS Code

8542.31.00.01

Bit Size

8

CPU Family

8051

JESD-30 Code

R-PDIP-T24

JESD-609 Code

e0

Number of Terminals

24

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP24,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Power Supplies

5 V

Qualification Status

Not Qualified

RAM (bytes)

64

ROM (words)

2048

ROM Programmability

UVPROM

Speed

12 MHz

Supply Current-Max

17.5 mA

Supply Voltage-Nom

5 V

Surface Mount

NO

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Form

THROUGH-HOLE

Terminal Pitch

2.54 mm

Terminal Position

DUAL