SPC5566MVR132

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Product Technical Specifications

Source Content uid

SPC5566MVR132

Rohs Code

Yes

Part Life Cycle Code

Active

Package Description

BGA, BGA416,26X26,40

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

45 Weeks

Has ADC

YES

Address Bus Width

24

Bit Size

32

CPU Family

E200

Clock Frequency-Max

20 MHz

DMA Channels

YES

External Data Bus Width

32

JESD-30 Code

S-PBGA-B416

JESD-609 Code

e1

Length

27 mm

Moisture Sensitivity Level

3

Number of I/O Lines

256

Number of Terminals

416

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA416,26X26,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

260

Power Supplies

1.5,3.3,5 V

Qualification Status

Not Qualified

RAM (bytes)

131072

ROM (words)

3145728

ROM Programmability

FLASH

Screening Level

AEC-Q100

Speed

135 MHz

Supply Current-Max

785 mA

Supply Voltage-Max

1.65 V

Supply Voltage-Min

1.35 V

Supply Voltage-Nom

1.5 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

AUTOMOTIVE

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

40

Width

27 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Fast Shipping

Alternate Parts

MPC5566MVR132

SPC5566MVR144