SPC5606BK0MLQ6

No Match Found

Product Technical Specifications

Source Content uid

SPC5606BK0MLQ6

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

LQFP, QFP144,.87SQ,20

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

52 Weeks

Bit Size

32

JESD-30 Code

S-PQFP-G144

Length

20 mm

Moisture Sensitivity Level

3

Number of Terminals

144

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC

Package Code

LQFP

Package Equivalence Code

QFP144,.87SQ,20

Package Shape

SQUARE

Package Style

FLATPACK, LOW PROFILE

Peak Reflow Temperature (Cel)

260

Power Supplies

3.3/5 V

Qualification Status

Not Qualified

RAM (bytes)

81920

ROM (words)

1048576

ROM Programmability

FLASH

Screening Level

AEC-Q100

Speed

64 MHz

Surface Mount

YES

Technology

CMOS

Temperature Grade

AUTOMOTIVE

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

40

Width

20 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC