STM32F031F6P7

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Product Technical Specifications

Source Content uid

STM32F031F6P7

Part Life Cycle Code

Active

Ihs Manufacturer

STMICROELECTRONICS

Package Description

TSSOP-20

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

53 Weeks, 1 Day

Has ADC

YES

Address Bus Width

Bit Size

32

CPU Family

CORTEX-M0

Clock Frequency-Max

32 MHz

DAC Channels

NO

DMA Channels

YES

External Data Bus Width

JESD-30 Code

R-PDSO-G20

Length

6.5 mm

Number of I/O Lines

15

Number of Terminals

20

On Chip Program ROM Width

8

Operating Temperature-Max

105 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (Cel)

NOT SPECIFIED

RAM (bytes)

4096

ROM (words)

32768

ROM Programmability

FLASH

Seated Height-Max

1.2 mm

Speed

48 MHz

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Form

GULL WING

Terminal Pitch

0.65 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Width

4.4 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Fast Shipping

Alternate Parts

STM32F031F6P7TR

STM32F031F4P6