STM32F103TBU6

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Product Technical Specifications

Source Content uid

STM32F103TBU6

Part Life Cycle Code

Active

Part Package Code

QFN

Package Description

HVQCCN, LCC36,.25SQ,20

Pin Count

36

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

53 Weeks, 1 Day

Has ADC

YES

Address Bus Width

Bit Size

32

CPU Family

CORTEX-M3

Clock Frequency-Max

25 MHz

DAC Channels

NO

DMA Channels

YES

External Data Bus Width

JESD-30 Code

S-XQCC-N36

JESD-609 Code

e3

Length

6 mm

Moisture Sensitivity Level

3

Number of I/O Lines

26

Number of Terminals

36

On Chip Program ROM Width

8

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

UNSPECIFIED

Package Code

HVQCCN

Package Equivalence Code

LCC36,.25SQ,20

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (Cel)

260

Power Supplies

2.5/3.3 V

Qualification Status

Not Qualified

RAM (bytes)

20480

ROM (words)

131072

ROM Programmability

FLASH

Seated Height-Max

1 mm

Speed

72 MHz

Supply Current-Max

50 mA

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

MATTE TIN

Terminal Form

NO LEAD

Terminal Pitch

0.5 mm

Terminal Position

QUAD

Width

6 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

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