STM32F103VEH6

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Product Technical Specifications

Source Content uid

STM32F103VEH6

Part Life Cycle Code

Active

Ihs Manufacturer

STMICROELECTRONICS

Part Package Code

BGA

Package Description

LFBGA-100

Pin Count

100

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

53 Weeks, 1 Day

Has ADC

YES

Address Bus Width

Bit Size

32

CPU Family

CORTEX-M3

Clock Frequency-Max

16 MHz

DAC Channels

YES

DMA Channels

YES

External Data Bus Width

JESD-30 Code

S-PBGA-B100

JESD-609 Code

e1

Length

10 mm

Moisture Sensitivity Level

3

Number of DMA Channels

12

Number of I/O Lines

80

Number of Terminals

100

Number of Timers

11

On Chip Program ROM Width

8

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA100,10X10,32

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Power Supplies

2.5/3.3 V

Qualification Status

Not Qualified

RAM (bytes)

65536

ROM (words)

524288

ROM Programmability

FLASH

Seated Height-Max

1.7 mm

Speed

72 MHz

Supply Current-Max

70 mA

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Width

10 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Fast Shipping

Alternate Parts

STM32F103VDH6STM32F103VCH6

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