STM32F103ZGH6

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Product Technical Specifications

Source Content uid

STM32F103ZGH6

Part Life Cycle Code

Active

Ihs Manufacturer

STMICROELECTRONICS

Part Package Code

BGA

Package Description

LFBGA-144

Pin Count

144

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

53 Weeks, 1 Day

Has ADC

YES

Address Bus Width

26

Bit Size

32

CPU Family

CORTEX-M3

Clock Frequency-Max

25 MHz

DAC Channels

YES

DMA Channels

YES

External Data Bus Width

16

JESD-30 Code

S-PBGA-B144

Length

10 mm

Number of I/O Lines

112

Number of Terminals

144

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA144,12X12,32

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

2.5/3.3 V

Qualification Status

Not Qualified

RAM (bytes)

98304

ROM (words)

1048576

ROM Programmability

FLASH

Seated Height-Max

1.7 mm

Speed

72 MHz

Supply Current-Max

68 mA

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Width

10 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Fast Shipping

Alternate Parts

STM32F103ZGH6TR

STM32F103ZGH6TR

STM32F103ZGH6

STM32F103ZGH6

STM32F103ZGH6