STM32W108HBU61

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Product Technical Specifications

Source Content uid

STM32W108HBU61

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Part Package Code

QFN

Package Description

6 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, VFQFPN-40

Pin Count

40

Manufacturer Package Code

VFQFPN

Reach Compliance Code

compliant

HTS Code

8542.31.00.01

Bit Size

32

CPU Family

CORTEX-M3

JESD-30 Code

S-XQCC-N40

JESD-609 Code

e3

Length

6 mm

Moisture Sensitivity Level

3

Number of Terminals

40

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

UNSPECIFIED

Package Code

HVQCCN

Package Equivalence Code

LCC40,.24SQ,20

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (Cel)

260

Power Supplies

1.25,1.8,2.5/3.3 V

Qualification Status

Not Qualified

RAM (bytes)

8192

ROM (words)

131072

ROM Programmability

FLASH

Seated Height-Max

1 mm

Speed

24 MHz

Supply Current-Max

150 mA

Supply Voltage-Max

1.32 V

Supply Voltage-Min

1.18 V

Supply Voltage-Nom

1.25 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

MATTE TIN

Terminal Form

NO LEAD

Terminal Pitch

0.5 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

30

Width

6 mm

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR CIRCUIT

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