STM8S003F3U6

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Product Technical Specifications

Source Content uid

STM8S003F3U6

Rohs Code

Yes

Part Life Cycle Code

Active

Part Package Code

QFN

Package Description

HVQCCN, LCC24,.19SQ,25

Pin Count

20

Manufacturer Package Code

UFQFPN

Reach Compliance Code

compliant

HTS Code

8542.31.00.01

Has ADC

YES

Address Bus Width

Bit Size

8

Boundary Scan

NO

CPU Family

STM8S

Clock Frequency-Max

16 MHz

DAC Channels

NO

DMA Channels

NO

External Data Bus Width

Format

FIXED POINT

Integrated Cache

NO

JESD-30 Code

S-XQCC-N20

Length

3 mm

Low Power Mode

YES

Number of External Interrupts

16

Number of I/O Lines

16

Number of Terminals

20

Number of Timers

3

On Chip Data RAM Width

8

On Chip Program ROM Width

8

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

PWM Channels

YES

Package Body Material

UNSPECIFIED

Package Code

HVQCCN

Package Equivalence Code

LCC24,.19SQ,25

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Qualification Status

Not Qualified

RAM (bytes)

1024

RAM (words)

1024

ROM (words)

8192

ROM Programmability

FLASH

Seated Height-Max

0.6 mm

Speed

16 MHz

Supply Current-Max

100 mA

Supply Voltage-Max

5.5 V

Supply Voltage-Min

2.95 V

Supply Voltage-Nom

3.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Form

NO LEAD

Terminal Pitch

0.5 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Width

3 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER

Alternate Parts

STM8S003F3U6TR

064ATSAMG55J19AMU

STM8S003F3U6

STM8S003F3U