T7005S55JG

Manufacturer: Integrated Device Technology Inc

Product Category: Memory

Description:

Product Technical Specifications

Source Content uid:

IDT7005S55JGI

Manufacturer Part Number:

IDT7005S55JGI

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Transferred

Ihs Manufacturer:

INTEGRATED DEVICE TECHNOLOGY INC

Part Package Code:

LCC

Package Description:

QCCJ, LDCC68,1.0SQ

Pin Count:

68

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.32.00.41

Manufacturer:

Integrated Device Technology Inc

Risk Rank:

7.41

Access Time-Max:

55 ns

I/O Type:

COMMON

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e3

Length:

24.2062 mm

Memory Density:

65536 bit

Memory IC Type:

DUAL-PORT SRAM

Memory Width:

8

Moisture Sensitivity Level:

1

Number of Functions:

1

Number of Ports:

2

Number of Terminals:

68

Number of Words:

8192 words

Number of Words Code:

8000

Operating Mode:

ASYNCHRONOUS

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

QCCJ

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

SQUARE

Package Style:

CHIP CARRIER

Parallel/Serial:

PARALLEL

Peak Reflow Temperature (Cel):

260

Power Supplies:

5 V

Qualification Status:

Not Qualified

Seated Height-Max:

4.572 mm

Standby Current-Max:

0.03 A

Standby Voltage-Min:

4.5 V

Subcategory:

SRAMs

Supply Current-Max:

0.3 mA

Supply Voltage-Max (Vsup):

5.5 V

Supply Voltage-Min (Vsup):

4.5 V

Supply Voltage-Nom (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Time@Peak Reflow Temperature-Max (s):

30

Width:

24.2062 mm

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