TC233LP32F200NACKXUMA1

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Product Technical Specifications

Rohs Code

Yes

Part Life Cycle Code

Active

Package Description

HTFQFP,

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Factory Lead Time

43 Weeks

Date Of Intro

2017-11-24

Has ADC

YES

Additional Feature

IT HAS 24 ADC AND FADC I/P LINES ,2 ADC MODULE

Address Bus Width

Bit Size

Clock Frequency-Max

200 MHz

DAC Channels

DMA Channels

YES

External Data Bus Width

JESD-30 Code

S-PQFP-G100

Length

12 mm

Moisture Sensitivity Level

Number of I/O Lines

Number of Terminals

100

On Chip Program ROM Width

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

PWM Channels

Package Body Material

PLASTIC/EPOXY

Package Code

HTFQFP

Package Shape

SQUARE

Package Style

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM (bytes)

196608

ROM (words)

2097152

ROM Programmability

FLASH

Seated Height-Max

1.2 mm

Speed

200 MHz

Supply Voltage-Max

1.43 V

Supply Voltage-Min

1.17 V

Supply Voltage-Nom

1.3 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

AUTOMOTIVE

Terminal Finish

NICKEL GOLD PALLADIUM SILVER

Terminal Form

GULL WING

Terminal Pitch

0.4 mm

Terminal Position

QUAD

Width