THGBMJG7C1LBAIL

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Product Technical Specifications

Part Life Cycle Code

Obsolete

Ihs Manufacturer

KIOXIA HOLDINGS CORP

Package Description

WFBGA-153

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.51

JESD-30 Code

R-PBGA-B153

Length

13 mm

Memory Density

137438953472 bit

Memory IC Type

FLASH CARD

Memory Width

8

Number of Functions

1

Number of Terminals

153

Number of Words

17179869184 words

Number of Words Code

16000000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Organization

16GX8

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA153,14X14,20

Package Shape

RECTANGULAR

Package Style

GRID ARRAY

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

2.7 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Form

BALL

Terminal Pitch

0.5 mm

Terminal Position

BOTTOM

Width

11 mm

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Alternate Parts

IS21ES16GJCLIBGA153

SMF33AE318