TMPN3150B1AFGBRD

Manufacturer: Toshiba America Electronic Components

Product Category: Microcontrollers and Processors

Description:

Product Technical Specifications

Source Content uid:

TMPN3150B1AFG(BR,D)

Manufacturer Part Number:

TMPN3150B1AFG(BR,D)

Part Life Cycle Code:

Obsolete

Part Package Code:

QFP

Package Description:

QFP,

Pin Count:

Reach Compliance Code:

unknown

HTS Code:

8542.31.00.01

Manufacturer:

Toshiba America Electronic Components

Risk Rank:

9.47

Address Bus Width:

Boundary Scan:

Clock Frequency-Max:

10 MHz

Communication Protocol:

I2C

External Data Bus Width:

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

Low Power Mode:

YES

Number of Serial I/Os:

Number of Terminals:

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

SQUARE

Package Style:

FLATPACK

Seated Height-Max:

3.15 mm

Supply Voltage-Max:

5.5 V

Supply Voltage-Min:

4.5 V

Supply Voltage-Nom:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Form:

GULL WING

Terminal Pitch:

0.8 mm

Terminal Position:

QUAD

Width: