TMS320DM365ZCED30

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Product Technical Specifications

Source Content uid

TMS320DM365ZCED30

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Active

Part Package Code

BGA

Package Description

LFBGA, BGA338,19X19,25

Pin Count

338

Reach Compliance Code

compliant

ECCN Code

3A991.A.2

HTS Code

8542.31.00.01

Bit Size

32

Bus Compatibility

I2C; SPI; UART; USB

External Data Bus Width

32

Format

FIXED POINT

JESD-30 Code

S-PBGA-B338

JESD-609 Code

e1

Length

13 mm

Moisture Sensitivity Level

3

Number of Terminals

338

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA338,19X19,25

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Power Supplies

1.35,1.8,3.3 V

Qualification Status

Not Qualified

RAM (words)

8192

Seated Height-Max

1.3 mm

Supply Voltage-Max

1.42 V

Supply Voltage-Min

1.28 V

Supply Voltage-Nom

1.35 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

0.65 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Width

13 mm

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR CIRCUIT

Alternate Parts

TMS320DM365ZCE21