VCBU68WMCE30

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Product Technical Specifications

Source Content uid

VCBU68WMCE30

Pbfree Code

Yes

Rohs Code

Yes

Part Life Cycle Code

Active

Package Description

LFBGA,

Reach Compliance Code

compliant

JESD-30 Code

S-PBGA-B338

JESD-609 Code

e1

Length

13 mm

Moisture Sensitivity Level

3

Number of Terminals

338

Operating Temperature-Max

85 °C

Operating Temperature-Min

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Seated Height-Max

1.3 mm

Supply Voltage-Max

1.42 V

Supply Voltage-Min

1.28 V

Supply Voltage-Nom

1.35 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

TIN SILVER COPPER

Terminal Form

BALL

Terminal Pitch

0.65 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Width

13 mm

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR CIRCUIT

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Alternate Parts

TMS320DM368ZCE48