VND830SPE

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Product Technical Specifications

Source Content uid

VND830SP-E

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Part Package Code

SOIC

Package Description

HSOP, SOP10,.55FL

Pin Count

Reach Compliance Code

not_compliant

ECCN Code

EAR99

HTS Code

8542.39.00.01

Built-in Protections

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver Number of Bits

Interface IC Type

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

JESD-30 Code

R-PDSO-G10

JESD-609 Code

Length

9.4 mm

Moisture Sensitivity Level

Number of Functions

Number of Terminals

Output Current Flow Direction

SOURCE

Output Current-Max

6 A

Output Peak Current Limit-Nom

9 A

Package Body Material

PLASTIC/EPOXY

Package Code

HSOP

Package Equivalence Code

SOP10,.55FL

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (Cel)

250

Power Supplies

8/36 V

Qualification Status

Not Qualified

Seated Height-Max

3.75 mm

Supply Voltage-Max

36 V

Supply Voltage-Min

5.5 V

Supply Voltage-Nom

13 V

Surface Mount

YES

Terminal Finish

Matte Tin (Sn) - annealed

Terminal Form

GULL WING

Terminal Pitch

1.27 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

Width

7.5 mm

Cart