W25Q64FVSSIG Winbond Electronics Corp | Chip 1 Exchange

W25Q64FVSSIG

Manufacturer: Winbond Electronics Corp

Product Category: Memory

Description:

Product Technical Specifications

Manufacturer Part Number:

W25Q64FVSSIG

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Obsolete

Ihs Manufacturer:

WINBOND ELECTRONICS CORP

Part Package Code:

SOIC

Package Description:

SOP, SOP8,.3

Pin Count:

8

Reach Compliance Code:

compliant

ECCN Code:

EAR99

HTS Code:

8542.32.00.51

Manufacturer:

Winbond Electronics Corp

Risk Rank:

7.99

Samacsys Description:

3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI, SOIC-8

Samacsys Manufacturer:

Winbond

Alternate Memory Width:

1

Clock Frequency-Max (fCLK):

104 MHz

Data Retention Time-Min:

20

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

5.28 mm

Memory Density:

67108864 bit

Memory IC Type:

FLASH

Memory Width:

8

Moisture Sensitivity Level:

3

Number of Functions:

1

Number of Terminals:

8

Number of Words:

8388608 words

Number of Words Code:

8000000

Operating Mode:

SYNCHRONOUS

Operating Temperature-Max:

85 °C

Operating Temperature-Min:

-40 °C

Organization:

8MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

SQUARE

Package Style:

SMALL OUTLINE

Parallel/Serial:

SERIAL

Qualification Status:

Not Qualified

Seated Height-Max:

2.16 mm

Serial Bus Type:

SPI

Standby Current-Max:

0.00005 A

Supply Voltage-Max (Vsup):

3.6 V

Supply Voltage-Min (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.28 mm

Write Protection:

HARDWARE/SOFTWARE

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