WSF128K1637H1I

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Product Technical Specifications

Rohs Code

No

Part Life Cycle Code

Transferred

Part Package Code

PGA

Package Description

1.075X 1.075 INCH, HERMETIC SEALED, CERAMIC, PGA-66

Pin Count

66

Reach Compliance Code

unknown

ECCN Code

EAR99

HTS Code

8542.32.00.71

Additional Feature

SRAM IS ORGANISED AS 128K X 32

JESD-30 Code

S-CPGA-P66

JESD-609 Code

e4

Length

27.3 mm

Memory Density

2097152 bit

Memory IC Type

MEMORY CIRCUIT

Memory Width

16

Number of Functions

1

Number of Terminals

66

Number of Words

131072 words

Number of Words Code

128000

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Organization

128KX16

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Code

PGA

Package Shape

SQUARE

Package Style

GRID ARRAY

Qualification Status

Not Qualified

Seated Height-Max

4.6 mm

Supply Voltage-Max (Vsup)

5.5 V

Supply Voltage-Min (Vsup)

4.5 V

Supply Voltage-Nom (Vsup)

5 V

Surface Mount

NO

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

GOLD

Terminal Form

PIN/PEG

Terminal Pitch

2.54 mm

Terminal Position

PERPENDICULAR

Width

27.3 mm