XC3S1200E4FT256I

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Product Technical Specifications

Pbfree Code

No

Rohs Code

No

Part Life Cycle Code

Active

Part Package Code

BGA

Package Description

FTBGA-256

Pin Count

256

Reach Compliance Code

not_compliant

ECCN Code

EAR99

HTS Code

8542.39.00.01

Factory Lead Time

52 Weeks

Clock Frequency-Max

572 MHz

Combinatorial Delay of a CLB-Max

0.76 ns

JESD-30 Code

S-PBGA-B256

JESD-609 Code

e0

Length

17 mm

Moisture Sensitivity Level

3

Number of CLBs

2168

Number of Equivalent Gates

1200000

Number of Inputs

190

Number of Logic Cells

19512

Number of Outputs

150

Number of Terminals

256

Operating Temperature-Max

100 °C

Operating Temperature-Min

-40 °C

Organization

2168 CLBS, 1200000 GATES

Package Body Material

PLASTIC/EPOXY

Package Code

LBGA

Package Equivalence Code

BGA256,16X16,40

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (Cel)

225

Power Supplies

1.2,1.2/3.3,2.5 V

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status

Not Qualified

Seated Height-Max

1.55 mm

Supply Voltage-Max

1.26 V

Supply Voltage-Min

1.14 V

Supply Voltage-Nom

1.2 V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Lead (Sn63Pb37)

Terminal Form

BALL

Terminal Pitch

1 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Width

17 mm

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