XC3S1200E4FT256I

Manufacturer: AMD Xilinx

Product Category: Programmable Logic

Description:

Product Technical Specifications

Manufacturer Part Number:

XC3S1200E-4FT256I

Pbfree Code:

Rohs Code:

Part Life Cycle Code:

Active

Part Package Code:

BGA

Package Description:

FTBGA-256

Pin Count:

256

Reach Compliance Code:

not_compliant

ECCN Code:

EAR99

HTS Code:

8542.39.00.01

Manufacturer:

AMD Xilinx

Risk Rank:

6.89

Clock Frequency-Max:

572 MHz

Combinatorial Delay of a CLB-Max:

0.76 ns

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

Length:

17 mm

Moisture Sensitivity Level:

Number of CLBs:

2168

Number of Equivalent Gates:

1200000

Number of Inputs:

190

Number of Logic Cells:

19512

Number of Outputs:

150

Number of Terminals:

256

Operating Temperature-Max:

100 °C

Operating Temperature-Min:

-40 °C

Organization:

2168 CLBS, 1200000 GATES

Package Body Material:

PLASTIC/EPOXY

Package Code:

LBGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (Cel):

225

Power Supplies:

1.2,1.2/3.3,2.5 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

1.55 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.26 V

Supply Voltage-Min:

1.14 V

Supply Voltage-Nom:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

Width: