XC3S400AN4FGG400C

Manufacturer: AMD Xilinx

Product Category: Programmable Logic

Description:

Product Technical Specifications

Manufacturer Part Number:

XC3S400AN-4FGG400C

Pbfree Code:

Yes

Rohs Code:

Yes

Part Life Cycle Code:

Active

Ihs Manufacturer:

XILINX INC

Part Package Code:

BGA

Package Description:

FBGA-400

Pin Count:

400

Reach Compliance Code:

compliant

ECCN Code:

3A991.D

HTS Code:

8542.39.00.01

Manufacturer:

AMD Xilinx

Risk Rank:

1.34

Clock Frequency-Max:

667 MHz

Combinatorial Delay of a CLB-Max:

0.71 ns

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

Length:

21 mm

Moisture Sensitivity Level:

Number of CLBs:

896

Number of Equivalent Gates:

400000

Number of Inputs:

311

Number of Logic Cells:

8064

Number of Outputs:

248

Number of Terminals:

400

Operating Temperature-Max:

85 °C

Organization:

896 CLBS, 400000 GATES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA400,20X20,40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Peak Reflow Temperature (Cel):

250

Power Supplies:

1.2,1.2/3.3,3.3 V

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Qualification Status:

Not Qualified

Seated Height-Max:

2.43 mm

Subcategory:

Field Programmable Gate Arrays

Supply Voltage-Max:

1.26 V

Supply Voltage-Min:

1.14 V

Supply Voltage-Nom:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

OTHER

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

Width: